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Chip Beads(SMD Array) For General Signal Line
MZA Series MZA1210 Type
FEATURES * A single MZA series chip provides noise attenuation for two lines, making it ideal for use with I/O lines of various highly miniaturized. * Electronic equipment, such as portable products, which comprise high density circuitry. * Low crosstalk between adjacent circuits. * Internal electrodes feature low DC resistance, minimizing wasteful power consumption. * Electroplated terminal electrodes accommodate reflow soldering. * Monolithic structure ensures high reliability. * The products contain no lead and also support lead-free soldering. * It is a product conforming to RoHS directive. APPLICATIONS High-frequency noise countermeasure in computers, printers, VCRs, televisions, portable telephones, and other equipment. PRODUCT IDENTIFICATION MZA 1210 D 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions Lx W (3) Material code (4) Nominal impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING
* No polarity
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
1.250.15 0.35 to 0.40 0.5
1.000.15
0.200.15
0.350.15 0.350.15 0.500.10 0.3
Weight: 3mg Dimensions in mm
0.650.10
CIRCUIT DIAGRAM
TEMPERATURE RANGES
Operating/storage -55 to +125C
PACKAGING STYLE AND QUANTITIES
Packaging style Taping Quantity 5000 pieces/reel
10s max. 250 to 260C 230C Natural cooling
180C 150C Preheating 60 to 120s Time(s) Soldering 30 to 60s
HANDLING AND PRECAUTIONS * Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150C. * After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. * The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. * Do not expose the inductors to stray magnetic fields. * Avoid static electricity discharge during handling. * When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. * This product does not apply to flow soldering construction method.
* Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. * Please contact our Sales office when your application are considered the following: The device's failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
* All specifications are subject to change without notice. 004-02 / 20070329 / e9421_mza1210.fm
0.5
(2/2)
ELECTRICAL CHARACTERISTICS
Part No. MZA1210D330C MZA1210D680C MZA1210D121C MZA1210D241C
Impedance() 25%[100MHz] 33 68 120 240
DC resistance ()max. 0.3 0.5 0.8 1.2
Rated current (mA)max. 50 50 50 50
Rated voltage (V)max. 5 5 5 5
Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 2510C
TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1210D330C MZA1210D680C
500 400
Impedance() Impedance()
MZA1210D121C
1000 800
Z R Impedance()
500 400 300 200 100
X X
300 200 100 0
600
Z R X
Z R
400 200 0
1
10
100 1000 Frequency (MHz)
10000
0
1
10
100 1000 Frequency (MHz)
10000
1
10
100 1000 Frequency (MHz)
10000
MZA1210D241C
1600
Impedance()
1200
Z R
800
X
400
0
1
10
100 1000 Frequency (MHz)
10000
PACKAGING STYLES REEL DIMENSIONS
TAPE DIMENSIONS
1.5 +0.1 -0.0 1.750.1 300min. Dimensions in mm 1.450.2 3.50.05 8.00.3 0.8max. 1.20.2 4.00.1 2.00.05 4.00.1 160min. Taping 200min.
Sprocket hole
Cavity
1.0
2.00.5 o130.5 o210.8 o1782.0
9.00.3 13.01.4
o602.0 Dimensions in mm
Drawing direction
* All specifications are subject to change without notice. 004-02 / 20070329 / e9421_mza1210.fm


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